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ap63200/ap63201/ap63203/AP63205 3.8v to 32v input, 2a low iq synchronous buck with enhanced emi reduction description the ap63200/ap63201/ap63203/AP63205 is a 2a, synchronous buck converter with a wide input voltage range of 3.8v to 32v and fully integrates a 125m? high - side power mosfet and a 68m? low - si de power mosfet to provide high - efficiency step - down dc/dc conversion. the ap63200/ap63201/ap63203/AP63205 device is easily used by minimizing the external component count due to its adoption of peak current mode control along with its integrated compensation network. the ap63200/ap63201/ap63203/AP63205 has optimized designs for electromagnetic interference (emi) reduc tion. the converter features frequency spread spectrum (fss) with a switching frequency jitter of 6%, which reduces emi by not allowing emitted energy to stay in any one frequency for a significant period of time. it also has a proprietary gate driver scheme to resist switching node ringing without sacrificing mosfet turn - on and turn - off t imes, which further erases high - frequency radiated emi noise caused by mosfet switching. the device is available in a low - profile, tsot26 package. features ? v in 3.8 v to 32 v ? 2a continuous output current ? 0.8v 1% reference voltage ? 22 a ultral ow quiescent current ? switching frequenc y o 500khz: ap63200 and ap63201 o 1.1mhz: ap63203 and AP63205 ? pulse width modulation (pwm) regardless of output load o ap63201 ? supports pulse frequency modulation (pfm) o ap63200, ap63203, and AP63205 o up to 80% efficiency at 1ma light load o up to 88% efficiency at 5ma light load ? fixed output voltage o 3.3v: ap63203 o 5.0v: AP63205 ? proprietary gate driver design for best emi reduction ? frequency spread spectrum ( fss ) to reduce emi ? precision enable threshold to adjust uvlo ? protection circuitry o overvoltage protection o cycle - by - cycle peak current limit o thermal shutdown ? totally lead - free & fully rohs compliant (notes 1 & 2) ? halogen and antimony free. green device (note 3) pin assignments 12 3 4 5 6 fb en vin gnd sw bst tsot 26 top view applications ? 12v and 24v distributed power bus suppl ies ? flat screen tv s ets and monitors ? power tools and laser printers ? white goods and small home appliances ? fpga, dsp, and asic supplies ? home audio ? network systems ? set top boxes ? gaming consoles ? consumer e lectronics notes: 1. no purposely added lead. fully eu directive 2002/95/ec (rohs), 2011/65/eu (roh s 2) & 2015/863/eu (rohs 3) compliant . 2. see https://www.diodes.com/quality/lead - free/ for more information about diodes incorporateds definitions of halogen - and antimony - free, "green" and lead - free . 3. halogen - and antimony - free "green products are defined as those which contain <900ppm bromine, <900ppm chlorine (< 1500ppm total br + cl) and <1000ppm antimony compounds . ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 1 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 typical application circuit ap 63205 l 4.7h c3 1 00 n f c2 2x 22 f c1 10 f 3 v in 2 en 5 sw 6 bst 1 fb 4 gnd output v out 5v input figure 1. typical application circuit figure 2. efficiency vs. output current pin description s pin number pin name function 1 fb feedback sensing terminal for the output voltage . connect this pin to the resistive divider of the output . see setting the output voltage section for more details . 2 en enable input. en is a digital input that turns the regulator on or off. drive en high to turn on the regulator and low to turn it off. attach to v in or leave open for automatic startup. the en has a precision threshold of 1.18v for programing the uvlo. see e nable section for more detail s. 3 vin power input. vin supplies the power to the ic, as well as the step - down converter switches. drive vin with a 3.8v to 32 v power source. bypass vin to gnd with a suitably large capacitor to eliminate noise due to the switching of the ic . see input capacitor section for more details . 4 gnd power g round . 5 sw power switching output. sw is the switching node that supplies power to the output. connect the output lc filter from sw to the output load. note that a capacitor is required from sw to bst to power the high - side switch. 6 bs t high - side gate drive boost input. bst supplies the drive for the high - side n - channel mosfet . a 100nf capacitor is recommended from sw to bst to power the high - side switch. ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 2 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 functional block diagram 0.4v 0.8v 1.1v + - + - - + 0.6v + 0.8v internal ss error amplifier pwm comparator oscillator + logic - + ref ocp 7.6 nf 18 k ? s e = 0. 84 v/t r t = 0.2v/a uv p q1 q2 1 2 en fb 4 gnd 5 sw 6 bst 3 v in gm 20 k ? + - internal reference v cc regulator on 1. 18 v 1.5a 4a vsum comp csa figure 3. functional block diagram ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 3 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 absolute maximum ratings ( note 4) ( @t a = +25c, unless otherwise specified.) symbol parameter rating unit v in supply voltage - 0.3 to + 35 .0 (dc) v - 0.3 to + 40 .0 (400ms) v v sw switch node voltage - 1.0 to v in + 0.3 v v bst bootstrap voltage v sw - 0.3 to v sw + 6.0 v v fb feedback voltage - 0.3v to +6.0 v v en enable/uvlo voltage - 0.3v to + 35 .0 v t st storage temperature - 65 to +150 c t j junction temperature +160 c t l lead temperature +260 c esd susceptibility (note 5) hbm human body mode 2000 v cdm charge device model 10 00 v notes: 4 . stresses greater than the 'absolute maximum ratings' specified above may cause permanent damage to the device. these are stress ratings o nly; functional operation of the device at these or any other conditions exceeding those indic ated in this specification is not im plied. device reliability may be a ffected by exposure to absolute maximum rating conditions for extended periods of t ime. 5 . semiconductor devices are esd sensitive and may be damaged by exposure to esd event s. suitable esd precautions should be take n when handling and transporting these devices. thermal resistance (note 6) symbol parameter rating unit ja junction to ambient t sot26 89 c/w jc junction to case t sot26 39 c/w note: 6. test condition for t sot26: device mounted on fr - 4 substrate, single - layer pc board, 2oz copper, with minimum recommended pad layout . recommended operating conditions (note 7) (@ t a = +25c, unless otherwise specified.) symbol parameter min max unit v in supply voltage 3.8 32 v t a operating ambient temperature range - 40 +85 c note: 7. the device function is not guaranteed outside of the recommended operating conditions. ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 4 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 electrical characteristics (t a = +25c, v in = 12v, unless otherwise specified. min/max limits apply across the recommended ambient temperature range, - 40c to +85c , and input voltage range, 3.8v to 32v ). symbol parameter test conditions min typ max unit i shdn shutdown supply current v en = 0v 1 3 a i q supply current (quiescent) ap63201 : v en = open, v fb = 1.0v 258 a ap6320 0 /ap63203/AP63205 : v en = open, v fb = 1.0v 22 a uvlo v in under voltage threshold ( rising ) 3.30 3. 50 3. 70 v v in under voltage threshold hysteresis 44 0 mv r ds(on)1 high - side switch on - resistance (note 8) 125 m ? r ds(on)2 low - side switch on - resistance (note 8) 68 m ? i peak_limit hs peak current limit (note 8) 2.5 2.8 3.1 a i valley_limit ls valley current limit (note 8) 2.5 3.2 3.9 a f sw oscillator frequency ap63200/ap63201 500 khz ap63203/AP63205 1100 khz fss frequency spread spectrum 6 % t on minimum on time 80 ns v fb feedback voltage ccm, ap63200/ap63201 792 8 00 808 mv ccm, ap63203 3.27 3.30 3.33 v ccm, AP63205 4.95 5.00 5.05 v v en_ h en logic high 1.15 1.18 1.23 v v en_ l en l ogic low 1.05 1.10 1.15 v i en en input current v en = 1.5 v 5.5 a v en = 1v 1.5 a t ss soft - start period 4 ms t sd thermal shutdown (note 8) + 160 c t hys thermal hysteresis (note 8) + 25 c note : 8 . compliance to the datasheet limits is assured by one or more methods: production test, characterization, and/or design. ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 5 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 typical performance characteristics ( ap63200 @t a = +25c, v in = 12v, v out = 5v, unless otherwise specified.) figure 4. efficiency vs. output current, vin = 12v figure 5. efficiency vs. output current, vin = 24v figure 6. load regulation , vout = 5v figure 7. line regulation , vout = 5v figure 8. feedback voltage vs. temperature figure 9. power switch r ds(on) vs. temperature ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 6 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 typical performance characteristics (continued) figure 10. i q vs. temperature figure 11. i shdn vs. temperature figure 12. f sw vs. temperature figure 13. vin por and uvlo vs. temperature figure 14. startup using en, iout = 2a figure 15. shutdown using en, iout = 2a en (5v/div) vout (2v/div) i l (2a/div) sw (10v/div) 2ms/div en (5v/div) vout (2v/div) i l (2a/div) sw (10v/div) 50s/div ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 7 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 typical performance characteristics (continued) figure 16. output ripple, iout = 2a figure 17. load transient, iout = 1a to 2a figure 18. output short protection, iout = 2a figure 19. output short recovery, iout = 2a v out ripple (20mv/div) i l (1a/div) sw (10v/div) 2s/div v out ripple (500mv/div) i out (1a/div) 1ms/div v out (2v/div) i l (2a/div) sw (10v/div) 10ms/div v out (2v/div) i l (2a/div) sw (10v/div) 10ms/div ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 8 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 application information ap63200 ap63201 l 2.2 h r1 30.9k r2 62k c3 100n f c2 2x22 f c1 10 f 3 vin 2 en 5 sw 6 bst 1 fb 4 gnd output v out 1.2v input c4 100p f figure 20 . typical application circuit of ap63200/ap63201 ap63203AP63205 l c3 100n f c2 2x22 f c1 10 f 3 vin 2 en 5 sw 6 bst 1 fb 4 gnd output v out input figure 21. typical application circuit of ap63203/AP63205 1 pwm operation control the ap63200/ap63201/ap63203/AP63205 device is a 3.8v - to - 32v input, 2a output, emi friendly, fully integrated synchronous buck converter. refer to the block diagram in f igure 3. t he device employ s fixed - frequency peak current mode control. the internal clocks rising edge (500khz for ap6300 and ap63201, 1.1mhz for ap63203 and AP63205 ) initiates turning on the integrated high - side power mosfet , q1 , for each cycle . when q1 is on , the inductor current rises linearly , and the device charges the output cap acitor . the current across q1 is sensed and converted to a voltage with a ratio of r t via the csa block . the csa output is combined with an internal slope compensation, s e , resulting in v sum . when v sum rises higher than the internal comp node , the device turns off q1 and turns on the low - side power mosfet, q2. the inductor current decreases when q2 is on . on the rising edge of next clock cycle, q2 turns off , and q1 turns on . this sequence repeats every clock cycle . the peak current mode control with the internal loop compensation network and built - in 4ms soft - start simplifies the ap63200/ap63201/ap63203/AP63205 footprint as well as minimizes the external component count. the error amplifier generates the comp voltage by comparing the voltage on the fb pin with an internal 0.8v reference. an increase in load current cause s the feedback voltage to drop. the error amplifier thus raises the comp voltage until the avera ge inductor current matches the i ncreased load current. this feedback loop regulates the output voltage. the device also integrates internal slope compensation circuitry to prevent subharmonic oscillation when the duty cycle is greater than 50% for peak current mode control. the ap63200/ap63201/ap63203/AP63205 device implement s frequency spread spectrum (fss) with a switching frequency jitter of 6% . fss reduces emi by not allowing emitted energy to stay in any one frequency for a significant period of time. the converter further dampens high frequency radiated emi noise through the use of its proprietary gate driver scheme to achieve a ringing - free switching node voltage without sacrificing the mosfet switching times. ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 9 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 application information (continued) in order to provide a small output ripple in light load condition s , the ap63201 offers a fixed 500khz switching frequency with fss and pulse width modulation (pwm). the hiccup mode minimizes power dissipation during prolonged output overcurrent or short conditions. the hiccup wait time is 512 cycles and the hiccup restart time is 8192 cycles. the ap63200/ap63201/ap63203/AP63205 also feature s full protections including cycle - by - cycle high - side mosfet peak current limit, o vervoltage protection, and over tempe rature protection. 2 pulse frequency modulation in heavy load condition s , the ap63200 , ap63203 , and AP63205 operate at forced pwm mode. the internal comp node voltage decrease s as the load current decreases . at a certain limit, i f the load current is low enough, t he comp node voltage is clamped and is prevented from decreasing any further. the voltage at which comp is clamped correspond s to the 450ma peak inductor current. as the load current approaches zero, the ap63200 , ap63203 , and AP63205 enter pulse frequency modulation ( pfm ) to increase the converter power efficiency at light load condition s. t he ap63201 remain s in continuous conduction mode at light load conditions. when the inductor current decreases to zero, zero - cross det ection circuitry on the low - side power mosfet , q2, forces it off until the beginning of the next switching cycle. the buck converter does not sink current from the output when the output load is light and while the device is in pfm . because the ap6320 0 , ap63203 , and AP63205 work in pfm during light load conditions, they can achieve power efficiency of up to 88% at a 5ma load condition. the quiescent current of ap6320 0 , ap63203 and AP63205 is 22 a typical under a no - load , non - switching condition . 3 enable when disabled, the device shutdown supply current is only 1a. when applying a voltage higher than the en upper threshold (typical 1.18v , ris ing ), the ap63200/ap63201/ap63203/AP63205 enable s all functions , and the device initiates the soft - start phase. the ap63200/ap63201/ap63203/AP63205 ha s a built - in 4ms soft - start time to prevent output voltage oversh oot and inrush current. when the en voltage falls below its lower threshold (typical 1.1v, falling), the internal ss voltage is discharged to ground and device operation is disabled. an internal 1.5 a pull - up current source connected from the internal ldo - regulated vcc to the en pin guarantees that a high on th e en p in automatically enables the device. for application s requiring a higher vin uvlo voltage than is provided by the default setup, there is a 4 a hysteresis pull - up current source on the en pin that configures the vin uvlo voltage with an external resistive divid er ( r5 and r6 ) shown in figure 22 . the resist ive divider resistor values are calculated by equations eq.1 and eq.2. en 20 k ? + - on 1. 18 v i 1 1.5a i 2 4a vin r5 r6 2 figure 22. programming uvlo ? ? = ? . ??? ? ? ?? ? ? ??? ? . ??? e q. 1 ? ? = ? . ?? ? ? ??? ? ? . ?? + ? . ??? ? ? ? e q. 2 where: ? v on is the rising edge voltage to enable the regulator ? v off is the falling edge voltage to disable the regulator ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 10 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 application information (continued) alternatively, a small ceramic capacitor can be added from en to gnd. this delay s the output startup voltage, which is useful whe n sequencing multiple power rails to minimize input inrush current. the amount of capacitance i s calculated by equation eq.3. ? ? [ ?? ] = ? . ?? ? ? ? [ ?? ] eq. 3 where: ? c d is the time delay capacitance in nf ? t s is the delay time in ms the en pin is a high voltage pin and can be directly connected to vin to automatically start up the device as vin increases. 4 under v oltage lockout under v oltage l ockout is implemented to prevent the ic from insufficient input voltages . the ap63200/ap63201/ap63203/AP63205 device has a uvlo comparator that monitors the input voltage and the internal bandgap reference. if the input voltage falls below 3.1v, the ap63200/ap63201/ap63203/AP63205 is disable d . in this event, both the h igh - side and low - side power mosfets are turned off . 5 emi reduction with frequency spread spectrum and ringing - free switching node in the some applications, the system must meet emi standard s . to improve emi reduction , the ap63200/ap63201/ap63203/AP63205 adopt s fss to spread the switching noise over a wider frequency band and therefore reduces conducted and radiated interference at a particular frequency. in buck converter s , the switching node s (sws) ringing amplitude and cycles are critical , especially in relation to the high frequency radia tion emi noise. the ap63200/ap63201/ap63203/AP63205 device implement s a multi - level gate driver scheme to achieve a ringing - free switching node without sacrificing neither the switching node s rise and fall slew rate s nor the converters power efficiency. the ap63203 and AP63205 also have the feature to remove the resonance ringing of the sw pin when the inductor current is 0a and the device operates in pfm . the zoomed in waveform for sw is shown in figu re 2 3. figure 23. ap63203/AP63205 sw node waveform 6 over c urrent protection the ap63200/ap63201/ap63203/AP63205 h as cycle - by - cycle peak current limit protection by sensing the current through the internal high - side power mosfet q1 . while q1 is on, its conduction current is monitored by the internal sensing circuitry. once the current through q1 exceeds the current peak limit, q1 immediately turns off. if q 1 consistently hits the peak current limit for 2 ms , the buck converter enters hiccup mode and shuts down. after 16 ms of off time , the buck converter restarts powering up. h iccup mode reduce s the power dissipation in the overcurrent condition. 7 thermal s hutdown if the junction temperature of the device reaches the thermal shutdown limit of +15 0c, the ap63200/ap63201/ap63203/AP63205 shut s down both their high - side and low - side power mosfets . when the junction temperature reduces to the required level ( + 130c nominal), the device initiates a normal power - up cycle with soft - start . sw (5v/div) il (1a/div) no sw ringing 2 s/div ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 11 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 application information (continued) 8 power derating characteristics to prevent the regulator from exceeding the maximum junction temperature, some thermal analysi s is required. the temperature rise is given by: ? ???? = ?? ? ( ? ?? ) e q. 4 where pd is the power dissipated by the regulator and ja is the thermal resistance from the junction of the die to the ambient temperature. the junction temperature, t j , is given by: ? ? = ? ? + ? ???? e q. 5 where t a is the ambient temperature of the environment. for the tsot26 package, the ja is 89 c/w. the actual junction temperature should not exceed the absolute maximum junction temperature of +125 c when considering the thermal design. a typical derating curve versus ambient temperature is shown in figure 24. figure 24. output current derating curve vs . temperature , vin = 12v 9 setting the output voltage the ap63203 and ap 63205 have fixed output voltages of 3.3v and 5v, respectively. the ap63200 and ap63201 have adjustable output voltage s starting from 0. 8v using an external resist ive divider. an optional in figure 20 , of 10pf to 220pf is used to improve the transient response. resistor r 2 is selected based on a design tradeoff between efficiency and output voltage accur acy. t here is less current consumption in the feedback network f or high values of r 2 . r1 can be determined by the following equation: ? ? = ? ? ? ( ? ??? ? . ?? ? ? ) e q. 6 ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 12 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 application information (continued) table 1 shows a list of recommended component selection s for common output voltages for ap6300 and ap63201 referencing f igure 20 . ap63200/ap63201 output voltage (v) r1 (k ? ) r2 (k ? ) l (h) c1 ( f) c2 ( f) c3 (n f) c4 (pf) 1.2 30.9 62 2 .2 10 2 x 22 100 100 1.5 54.2 62 2.2 10 2 x 22 100 100 1.8 77.5 62 3.3 10 2 x 22 100 100 2.5 131 62 3. 3 10 2 x 22 100 100 3.3 182 62 6.8 10 2 x 22 100 100 5 157 30 10 10 2 x 22 100 100 12 249 18 10 10 2 x 22 100 56 table 1. recommended component selections for ap63200/ap63201 table s 2 and 3 show recommended component selection s for ap63203 and AP63205 referencing f igure 21. ap63203 output voltage (v) l (h) c1 ( f) c2 ( f) c3 (n f) 3.3 3.9 10 2 x 22 100 table 2. recommended component selections for ap63203 AP63205 output voltage (v) l (h) c1 ( f) c2 ( f) c3 (n f) 5 4.7 10 2 x 22 100 table 3. recommended component selections for AP63205 10 inductor calculating the inductor value is a critical factor in designing a buck converter. for mo st designs, the following equation can be used to calculate the inductor value: ? = ? ??? ? ( ? ?? ?? ??? ) ? ?? ??? ? ?? ?? e q. 7 where ?i l is the inductor ripple current , and f sw is the buck converter switching frequency. for ap63200/ap63201/ap63203/AP63205 , c hoose ? i l to be 30% to 50% of the maximum load current of 2a . the inductor peak current is calculated by : ? ? ???? = ? ???? + ?? ? ? e q. 8 peak current determines the required saturation current rating, which influences the size o f the inductor. saturating the ind uctor decreases the converter efficiency while increasing the temperatures of the inductor and the internal power mosfets. therefore, choosing an inductor with the appropriate saturation current rating is important. for most applications, it is recommended to s elect an inductor of approximately 2.2 h to 10 h with a dc current rating of at least 35 % higher than the maximum load current . for highest efficiency, the inductors dc resistance should be less than 100m. use a larger inductance for improved efficiency under light load conditions. 11 input capacitor the input capacitor reduces the surge current drawn from the input supply as well as t he switching noise from the device. the input capacitor has to sustain the ripple current produced during the on time of q1 . it must have a low esr to minimize the losses. the rms current rating of the input capacitor is a critical parameter a nd must be higher than the rms input current. as a rule of thumb, select an input capacitor which has an rms rating greater than half of the maximum load current. due to large di/dt through the input capacitor, electrolytic , or ceramics with low esr should be used. if a tantalum capacitor is u sed it must be surge protected o r else capacitor failure could occur. using a ceramic capacitor greater than 10f is sufficient for most applications. ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 13 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 application information (continued) 12 output capacitor the output capacitor keeps the output voltage ripple small, ensures feedback loop stability , and reduces the overshoot/undershoot of the output voltage during load transients . during the first few milliseconds of a load transient, the output capacitor supplies the current to the load. the converter recognizes the load transient and sets the duty cycle to maximum but the curr ent slope is limited by the inductor v alue. the output capacitor, c out , requirements can be calculated from equations eq. 9 and eq. 10 . the esr of the output capacitor dominates the output voltage ripple. the amount of ripple can be calcu lated from eq. 9: ? ?? ? ?????? = ?? ? ? ??? e q. 9 an output capacitor with large capacitance and low esr is the best option. for most applications, a 22 f to 68 f ceramic capacitor is sufficient. to meet the load transient requirement, c out should be greater t han the following calculated from eq. 10: ? ??? > ???? ??? + ?? ? ? ? ? ( ??+? ??? ) ? ?? ??? ? e q. 10 where v is the maximum output overshoo t voltage . 13 bootstrap capacitor to ensure the proper operation, a ceramic capacitor must be connected between the bst and sw pins. a 100nf ceramic capacitor is sufficient. if the bst capacitor voltage falls below 2.3v , the boot undervoltage protection circuit turn s q2 on for 220ns to refresh the bst capacitor and raise its voltage back above 2.85v. the bst capacitor voltage threshold is always maintained to ensure enough driving capabilit y for q1 . this operation may arise during long periods of no switching such as in pfm with light load conditions . another event require s the refreshing of the bst capacitor i s when the input voltage drops cl ose to the output voltage. under this condition, the regulator enter s low d ropout mode by holding q1 on for multiple clock cycles. to prevent the bst c apac itor from discharging, q2 is forced to refresh. the effective duty cycle is approximately 100% so that it act s as an ldo to maintain the output voltage regulation. ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 14 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 layout pc b layout 1. the ap63200/ap63201/ap63203/AP63205 device work s at 2 a current load , so heat dissipation is a major concern in the layout of the pcb. 2oz c opper for both the top and bottom layer s is recommended. 2. provide sufficient vias for the input and output capacitor s gnd side to dissipate heat to the bottom layer. 3. make the bottom layer under the device as the gnd layer for heat dissipation. the gnd layer should be as large as possible to provide better thermal effect. 4. place the vin capacitors as close to the device as possible. 5. place the feedback component s as close to fb as possible. 6. see f igure 25 for reference. c1 c2 l1 c3 c4 r1 r2 vin vout sw 12 3 4 5 6 fb en vin gnd sw b st gnd figure 25. recommended layout ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 15 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 ordering information please see http://www.diodes.com/package - outlines.html for additional latest information such as mechanical data and device t ape orientation. ap 6320 x xx - x packing product version package 7 : tape & reel wu : tsot 26 0 : ap 63200 1 : ap 63201 3 : ap 63203 5 : ap 63205 part number m ode frequency v out package code tape and reel quantity part number suffix ap63200wu -7 pwm/ pfm 500khz adjustable wu 3000 -7 ap63201wu -7 pwm only 500khz adjustable wu 3000 -7 ap63203wu -7 pwm/ pfm 1100 k hz 3.3v wu 3000 -7 AP63205wu -7 pwm/ pfm 1100khz 5v wu 3000 -7 marking information t so t26 1 2 3 6 7 4 x x y w x xx : identification code y : year 0~9 x : internal code (top view) 5 w : week : a~z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week part number package identification code ap63200wu -7 tsot26 t2 ap63201wu -7 tsot26 t3 ap63203wu -7 tsot26 t4 AP63205wu -7 tsot26 t5 ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 16 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 package outline dimensions please see http://www.diodes.com/package - outlines.html for the latest version. tsot26 tsot26 dim min max typ a ? 1.00 a1 0.010 0.100 a2 0.840 0.900 d 2.800 3.000 2.900 e 2.800 bsc e1 1.500 1.700 1.600 b 0.300 0.450 c 0.120 0.200 e 0.950 bsc e1 1.900 bsc l 0.30 0.50 l2 0.250 bsc 0 8 4 1 4 12 all dimensions in mm suggested pad layout please see http://www.diodes.com/package - outlines.html for the latest version. tsot26 dimensions value (in mm) c 0.950 x 0.700 y 1.000 y1 3.199 d e1 e1/2 e1 e e/2 e a a2 a1 seating plane 0 l2 l gauge plane 01( 4x) 01( 4x) c b seating plane y1 c x y ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 17 of 18 www.diodes.com january 2019 ? diodes incorporated
ap63200/ap63201/ap63203/AP63205 important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this documen t, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other c hanges without further notice to this document and any product described herein. diodes incorporated does not ass ume any liability arising out of the application or use of this document or any product described herein; neither does diodes incorporated convey any li cense under its patent or trademark rights, nor the rights of others. any customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represent ed on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. should customers purchase or use diodes incorporated products for any unintended or unauthorized application, customers shall indemnify and hold diodes incorporated and its representatives harmless against all claims, damages, expenses, and at torney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized a pplication. products described herein may be covered by one or more united states, international or f oreign patents pending. product name s and markings noted herein may also be covered by one or more united states, international or foreign trademarks. th is document is written in english but may be translated into multiple languages for reference. only the english version of this document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critic al components in life support devices or systems without the express written approval of the chief executive officer of diodes incorporated. as used herein: a. life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with ins tructions for use provided i n the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support device or system whose f ailure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. c ustomers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support de vices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety - related requirements concerning their products and any use of diodes incorporated products in such safety - critical, life support devices or systems, notwithstanding any devices - or systems - related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporated and its representatives against any damages arising out of the use of diodes incorporated products in such safet y - critical, life support devices or systems. copyright ? 201 9 , diodes incorporated www.dio des.com ap63200/ap63201/ap63203/AP63205 document number: ds41326 rev. 2 - 2 18 of 18 www.diodes.com january 2019 ? diodes incorporated

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